ITC Patent Complaint Filed on Integrated Circuit Packages
According to the International Trade Commission, a section 337 patent complaint on certain integrated circuit packages provided with multiple heat-conducting paths and products containing same was filed on behalf of Industrial Technology Research Institute and ITRI International on May 31, 2012. The proposed respondents are:
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- LG Electronics Inc., South Korea
- LG Electronics USA, Inc., Englewood Cliffs, New Jersey
(D/N 2899, Received 05/31/12)
*Corrected 06/05/12 to reflect the correct the name of the proceeding